| سال | هفته | ID | Title | ApplNo | IPC | Applicant | Subgroup | زیر گروه | رشته | شرح | Description |
|---|
2026 | 03 | WO/2026/011967 | FLAME-RETARDANT FDC ACQUISITION CIRCUIT, PREPARATION METHOD THEREFOR AND USE THEREOF | CN2025/095597 | C09J 133/08 | SHENZHEN YN TECH CO., LTD. | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 03 | WO/2026/013470 | COMPOSITIONS AND ARTICLES COMPRISING (METH)ACRYLATE POLYMER AND MONOMER | IB2025/055952 | C09J 4/06 | 3M INNOVATIVE PROPERTIES COMPANY | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 03 | WO/2026/013644 | WATER-BASED ADHESIVE COMPOSITION INCLUDING SUGAR ALCOHOL AND RELATED METHODS | IB2025/057070 | C09J 11/06 | 3M INNOVATIVE PROPERTIES COMPANY | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 03 | WO/2026/013981 | FLUORORUBBER TACKINESS AGENT COMPOSITION | JP2025/007604 | C09J 115/02 | UNIMATEC CO.,LTD. | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 03 | WO/2026/014204 | HOT-MELT ADHESIVE COMPOSITION | JP2025/022400 | C09J 123/26 | TOYOBO MC CORPORATION | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 03 | WO/2026/014350 | THERMALLY CONDUCTIVE EASILY DISMANTLED ADHESIVE COMPOSITION, THERMALLY CONDUCTIVE EASILY DISMANTLED ADHESIVE SHEET, BONDED BODY, AND BONDED BODY DISMANTLING METHOD | JP2025/024006 | C09J 201/00 | NITTO DENKO CORPORATION | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 03 | WO/2026/014377 | FILLER-CONTAINING FILM, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING SAME | JP2025/024168 | C09J 7/30 | DEXERIALS CORPORATION | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 03 | WO/2026/014381 | FILLER-CONTAINING FILM, CONNECTION STRUCTURE, AND PRODUCTION METHOD FOR SAME | JP2025/024197 | C09J 7/30 | DEXERIALS CORPORATION | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 03 | WO/2026/014398 | ADHESIVE COMPOSITION AND PROTECTIVE SHEET | JP2025/024289 | C09J 201/00 | NITTO DENKO CORPORATION | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 03 | WO/2026/014479 | MOISTURE-CURABLE COMPOSITION FOR SHOES AND METHOD FOR REPAIRING SHOES | JP2025/024680 | C09J 143/04 | CEMEDINE CO., LTD. | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 03 | WO/2026/014480 | MOISTURE-CURABLE COMPOSITION FOR SHOES AND METHOD FOR REPAIRING SHOES | JP2025/024681 | C09J 143/04 | CEMEDINE CO., LTD. | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی |